PacTech laser soldering and packaging technology
نویسندگان
چکیده
منابع مشابه
Laser Ablation – Emerging Patterning Technology for Advanced Packaging
INTRODUCTION Wafer Level Packages have emerged as the fastest growing semiconductor packaging technology. Rather than a single solution, wafer level packaging technologies are a set of different solutions including flip-chip wafer bumping, electroplated gold, solder bumps and recent copper pillar technologies. These chips can be
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Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG) is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which w...
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A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...
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This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...
متن کاملSolder doped polycaprolactone scaffold enables reproducible laser tissue soldering.
BACKGROUND AND OBJECTIVES In this in vitro feasibility study we analyzed tissue fusion using bovine serum albumin (BSA) and Indocyanine green (ICG) doped polycaprolactone (PCL) scaffolds in combination with a diode laser as energy source while focusing on the influence of irradiation power and albumin concentration on the resulting tensile strength and induced tissue damage. MATERIALS AND MET...
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ژورنال
عنوان ژورنال: ELECTRONICS: Science, Technology, Business
سال: 2018
ISSN: 1992-4178
DOI: 10.22184/1992-4178.2018.179.8.130.132